The action mechanism of ultrasonic cleaning mainly includes the following aspects: due to the strong shock wave generated when the cavitation bubble bursts, a part of the dirt layer is peeled off, dispersed, emulsified and peeled off under the action of the shock wave.

The ultrasonic cleaning method is more than the conventional cleaning method, especially the surface of the workpiece is relatively complex, such as some mechanical parts with uneven surface and blind holes, and some products with special small size and high requirements for cleanliness, such as parts of clocks and precision machinery, electronic components, circuit board components, etc., which can achieve ideal results by ultrasonic cleaning.