Chip-On-Glass (COG) is a flip chip bonding method which?

is used for connect assembly of bare integrated circuits?

on glass substrate directly by using Anisotropic Conductive Film .?

The pitch of the IC bumps can be scaled down according to customers'

requirements . This method reduces the assembly area to the highest?

possible packing density, which especially important to those

applications that space saving is crucial. It allows a?

cost-effective mounting of driver chips because integrating?

flex PCB is no longer required. The IC is bonded directly onto

the glass substrate and is suitable for handling high-speed or high-frequency signals.